• English
  • 中文 (中国)
  • Mooreelite-Make IC Design Easy & EfficientMooreelite-Make IC Design Easy & EfficientMooreelite-Make IC Design Easy & EfficientMooreelite-Make IC Design Easy & Efficient
    • Home
    • IC Design Service
      • IC Design
      • IT/CAD and EDA Cloud Computing
      • IP Cloud
    • Supply Chain Management
      • Silicon service
      • Packaging Service
      • Testing Service
      • Mass Production Management
      • Industry&Finance Convergence
    • Semiconductor Talent Service
      • Education and Training
      • Recruitment
      • Social Media
    • About Us
      • Board of Directors
      • Contact Us
      • Join Us

    Introduction of Chip Testing Service

    With our own testing equipment, MooreElite provides three types of testing services: sample verification, mass production and product engineering.

    Commit to "Design Win" for customers

    Sample verication
    Cover 80% of mainstream ATE
    ATE Program development + hardware design& manufacture
    Mass production test
    Cooperate with professional
    testing house
    Autonomous testing equipment
    Product Management
    Expert team with more than 30 years experience
    Industry-leading product quality system

    Sample verication

    Through the in-depth cooperation between the excellent test engineering team and the overseas expert team, we provide the development and debugging of the mainstream ATE platform test program. At the same time, the relevant test hardware can be purchased in MooreElite to help customers solve engineering problems on testing.

    • Program development and debugging
    • Testing hardware production
    Type Developable platform
    SOC & digital signal V93K series、J750 series、该系列ATE设备 series
    Analog & mixed signal STS 8XXX series
    RF NI STS series
    Application test Hardware
    Wafer test CP Probecard
    End product test Loaboard、Socket、ChangeKits
    Professional service team
  • 10+ DFT engineers,average working experience > 5 years.
  • 20+ test development engineers,average working experience > 5 years.
  • Elite team member from Teradyne / Advantest / Verigy / SMIC / ASE.
  • Strong alliance
  • Collaboration with leading ATE/instrument/tool vendors.
  • Collaboration with major Lab in Beijing/Shanghai/Xi'an.
  • Strategic partnership with many packaging & testing suppliers.
  • One-stop services platform
  • MooreElite one-stop services platform provide great synergy for customer with integrated IP, Design services, Tape-out, packaging and testing services.
  • Multiple platform development
  • SOC & high speed Digital、MCU & Memory、Mix signal、RF、Other
  • Abundant testing resources
  • with strategic collaboration with leading testing equipment vendors and labs
  • Strong interface vendor
  • With high quality & competitive cost interface(Probe Card、Load Board、Socket、Docking etc.)
  • Mass production test plan optimization
  • Aggregate factory resources and provide best test plan and the most suitable MP testing services.
  • Mass production test

    MooreElite cooperates with mainstream OSAT to provide mass production capacity. With hundreds of our autonomous and controllable this series of ATE equipment, we can flexibly and adequately meet capacity requirements of customers whether it is the peak or trough of industry production capacity.

    • Cooperative factory
    Sorting machines Targeted products Assembly and testing factories The third-party test factories
    Pick & Place QFN、QFP、LGA、BGA,etc. TF、AMK、JCT ATEC、CMC、ADT
    Turret DFN、QFN、QFP,etc. CS、TF ATEC、ADT、AC
    Gravity SOP、SOT,etc. JCT、TF CMC、LC、AC

    Autonomous and controllable ATE

    In order to help customers solve the problems of difficult test program development and large fluctuations in production capacity, we own our autonomous and controllable ATE equipment:this series of ATE equipment, which helps customers to increase the flexibility of testing production capacity and to reduce testing costs.

    Mature and reliable equipment
    More than10 billion tested products
    More than 20 years of iterative R&D
     
     
    High cost-effective
    Reduce 50%+ cost per chips
    Cover 70%+ of testing requirement of chips
     
     
    Great technical strength
    Equipment R&D team with more than
    30 years of working experience
    Testing application team with more than
    25 years of working experience

    This series of ATE equipment was developed by TI–Texas Instruments. After 20 years of continuous iteration, it has conducted stable and reliable mass production test shipments for tens of billions of chips. Its mature and stable quality has created higher value for Texas Instruments’ chip products.

    Digital
  • 512 digital channels(unlimited vector depth)
  • 16 high-speed clock(<700Mhz)
  • 2 high-speed TMUs
  • 256 Source/Capture channels
  • Analog
  • Up to 276 power supplies or analog V/Is
  • 26 Analog Wave Generators
  • 19 Analog Digitizers
  • Mixed Signel
  • 8 high-speed differential Analog Wave Generators
  • 8 high-speed Analog Digitizers
  • RF
  • 8 high-speed differential Analog Digitizers
  • This series of ATE equipment is an ultra-cost-effective digital-analog mixed signal testing machine, with a matching radio frequency scheme. Its performance can cover the testing requirements of most types of chips

    Costdown is the strength of ATE equipment. Taking the example of Unisoc, as one of the leading semiconductor enterprises in China, it reduced the unit test cost of its products more than 50% through the use of this series of ATE equipment.

    With the original R&D team of This series of ATE equipment equipment and the experienced team with more than 30 years of equipment development experience and more than 25 years of application experience, MooreElie provides customized testing services and develop the next-generation test equipment.

    With the participation of international team of experts , MooreElite owns engineering team with a better understanding of products, to provide industry-leading product quality system management, control services, improve product yield, reduce failure rate, improve product quality and help customer products win more orders.

    Successful Cases

    Chip 芯片内容 Testing Service
    Communication base station chip 28nm/BGA/10Gbps Serdes Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    Baseband chip 28nm/Sip BGA/4G Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    IoT chip 55nm/BGA/NB-lot Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing
    4G Tx chip 40nm/BGA Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    3G PA chip 40nm/QFN Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    3G RF switch 90nm/LGA Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    Secondary power supply Sip/5.5V/5V Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    PMIC QFN/4A/10bit ADC Low Volume Manufacturing /High Volume Manufacturing
    NOR Flash 16MB/SPI Engineering Verification / Characteristic Analysis / Reliability Test / Low Volume Manufacturing /High Volume Manufacturing
    3D SRAM SOP/4GB Engineering Verification
    DDR2 FBGA/128M Engineering Verification
    AD/DA 3GSPS/8bit;2.5GSPS/14bit Engineering Verification

               

    留下您的需求,我们会第一时间与您联系

    021-51137892  sales@mooreelite.com            
    我有需求

    留下您的任意需求
    我们都会第一时间和您联系

    我有需求
    我有需求

    MooreElite Group

    Contact Us
  • sales@mooreelite.com
  • +86-021-51137892
  • 上海总部

    地址:

    上海市浦东新区荣科路118号2号楼

    邮编:

    201203

    Shanghai
    Building 2, No.118 Rongke Road, Pudong District, Shanghai
    Beijing
    19 F, Chuangfu Building, No.18 Danling Street, Haidian District,Beijing
    Chongqing
    3-4F, C1 Building, No.19 Xiantao Data Valley East Road, Yubei District, Chongqing
    Hefei
    Room 502, Block C, Building G4 , Phase II Innovation Industrial Park
    Hefei, Anhui Province (packaging factory location)
    Shenzhen
    2F, Block E, Building 5, Software Industry Base,Nanshan District,Shenzhen
    Chengdu
    Room 108, Block A, No.3 Gaopeng Avenue, Chengdu, Sichuan Province
       友情链接:   上海戈登网络科技有限公司    E课网~专业集成电路IC职业教育平台
    Copyright©2020 摩尔精英集成电路产业发展(合肥)有限公司     MooreElite All Rights Reserved
    公司注册地:合肥市高新区望江西路800号创新产业园二期G4-402/502    皖ICP备19011903号-6     皖公网安备 34019202000643号
    • Home
    • IC Design Service
      • IC Design
      • IT/CAD and EDA Cloud Computing
      • IP Cloud
    • Supply Chain Management
      • Silicon service
      • Packaging Service
      • Testing Service
      • Mass Production Management
      • Industry&Finance Convergence
    • Semiconductor Talent Service
      • Education and Training
      • Recruitment
      • Social Media
    • About Us
      • Board of Directors
      • Contact Us
      • Join Us
    Mooreelite-Make IC Design Easy & Efficient
    中文