2022
Oct. The first automotive IC started mass production testing at the Wuxi SiP Advanced Assembly & Test Centor
Sep. The number of patents authorized exceeded 100
Jul. MooreElite's ATE was successfully installed in a top OSATs in south Asia
May. Wuxi SiP advanced assembly & test site went into operation
2021
Jul. Design win of production test for world-leading RF IDM based on inhouse ATE
Jun. Chongqing lead type assembly site went into operation
Apr. Awarded "Novo-Star Company" by Shanghai Integrated Circuit Industry Association
2020
Oct. Merged overseas ATE company and acquired assets
Oct. Closed hundreds of millions of B financing round
Aug. Released "White Paper 2.0 on Cloud Computing for Chip Design" with Microsoft Azure
Jun. Started stratagic cooperation with Lenovo
2019
Nov. Released "White Paper 1.0 on Cloud Computing for Chip Design" with AWS
Jul. Hefei fast assembly site went into operation
Feb. Awarded with "上海市专精特新中小企业".
2018
Nov. Awarded with "National High-tech Enterprise"
Sep. Closed hundreds of millions of A financing round
Mar. Merged the IC training platform EECourse
Jan. Launched IT/CAD services
2017
Sep. Launched tape-out, assembly and test services
Jun. Participated in the release of "China IC Talent White Paper" since then
2016
Dec. Launched chip design services and supply chain services
Apr. Closed tens of millions of Pre-A financing round
2015
Jul. MooreElite was established, closed millions of angel financing round
2022
Oct.
The first automotive IC started mass production testing at the Wuxi SiP Advanced Assembly & Test Centor
Sep.
The number of patents authorized exceeded 100
Jul.
MooreElite's ATE was successfully installed in a top OSATs in south Asia
May.
Wuxi SiP advanced assembly & test site went into operation
2021
Jul.
Design win of production test for world-leading RF IDM based on inhouse ATE
Jun.
Chongqing lead type assembly site went into operation
Apr.
Awarded "Novo-Star Company" by Shanghai Integrated Circuit Industry Association
2020
Oct.
Merged overseas ATE company and acquired assets
Oct.
Closed hundreds of millions of B financing round
Aug.
Released "White Paper 2.0 on Cloud Computing for Chip Design" with Microsoft Azure
Jun.
Started stratagic cooperation with Lenovo
2019
Nov.
Released "White Paper 1.0 on Cloud Computing for Chip Design" with AWS
Jul.
Hefei fast assembly site went into operation
Feb.
Awarded with "上海市专精特新中小企业".
2018
Nov.
Awarded with "National High-tech Enterprise"
Sep.
Closed hundreds of millions of A financing round
Mar.
Merged the IC training platform EECourse
Jan.
Launched IT/CAD services
2017
Sep.
Launched tape-out, assembly and test services
Jun.
Participated in the release of "China IC Talent White Paper" since then
2016
Dec.
Launched chip design services and supply chain services
Apr.
Closed tens of millions of Pre-A financing round
2015
Jul.
MooreElite was established, closed millions of angel financing round
留下您的需求，我们会第一时间与您联系
留下您的任意需求
我们都会第一时间和您联系
